We Add Value Across IC Technology
and System Design

Show Me HowShow Me How

We are a rapid growing high-performance analog and mixed-signal IC design company. The core members of our R&D management team are senior experts in the industry.

30

Years cumulative know-how

150

Patents

330

Million units in products shipped and through licensing

Total System Adding Value: Chip + System

High Performance SoCs

CPS IC

• RX SOC
• TX SOC
• Leader in power management
and analog solutions

CPS System

• Qi TX ASIC for auto (CPSA2)
• Qi RX SoC for the consumer markets

Comprehensive
SW and IP

CPS

• Embedded software for Qi,
Airfuel and PMA
• Patented IP
• >10 years experience

Chip + System Design Experience

CPS IC

• Global Sales/FAE team
• Power experts • SoC design

CPS

• System expert • Coil design tools
• Software/firmware
• Design for manufacturing

World Leading Power, Analog and Wireless Power Innovation

SoCs. Modules. Finished Goods. Reference Designs. Manufacturing. Support Services.

The Team

Michael Jin

Chairman, Chief Technology Officer

+

Jack Pan

Chief Executive Officer

+

Camille Tang

Senior Vice President

+

Majid Kafi

Vice President, General Manager,
US Operation, Chip Business Group

+

Vikram Sangha

Chief Business Development Officer, US

+

Ken (Xun) Liu

Chief Technology Officer
Power Systems Group

+

Emmanuel Girma

Chief Operation Officer
Power Systems Group

+

Mohammad Nasser

Chief Scientist

Mohammad advises CPS on device and process semiconductor technology development.
He has 40 years senior design and development leadership in semiconductor industry process technology. His expertise is in both semiconductor operation and device physics and process/device development. His focus has been on mixed signal and analog BCD processes and device development utilizing fine line geometry CMOS. Until recently senior fellow and director of process development with Analog Devices and previously with National Semiconductor, Mohammad is a lifetime senior member of IEEE.

BSc, Honours, Physics, Tehran University, Iran

PhD, Solid State Physics, University of California, Los Angeles, USA

Michael Jin

Chairman, Chief Technology Officer

Michael is responsible for technology strategy through design centers in Beijing, Chengdu, Silicon Valley, Tianjin to support Power and Interface ICs in wireless power and USB Type-C applications. With over 20 years leadership experience, Michael co-founded 3 fabless IC design houses in Silicon Valley across primary feedback and adaptive switch technology (smart phone adapter. LED TV backlight), and analog front-end intellectual property (digital camera, digital TV and DVD applications in Japanese and Korean semiconductor power firms). With near 40 publications in international journals and conferences, he holds over 20 international patents.

BEng, Biomedical Engineering, Tsinghua University, PRC

MEng, Electrical Engineering, National University of Singapore, Singapore

PhD, Electrical Engineering, Stanford University, USA

Majid Kafi

Vice President, General Manager,
US Operation, Chip Business Group

Majid is responsible for the Silicon Valley design center to support Design, Application, Product, Test and Marketing for markets ranging from low power wearables to automotive, across technologies of wireless charging, high frequency multiphase controllers, fast charging, highly integrated PMICs. He is patent co-author of charging schemes improving both conventional and NVDC systems. He founded a PC-based Automatic Test Equipment company for semiconductors. With over 30 years’ senior management experience, Majid previously worked at ON Semiconductor, Integrated Device Technology.

BEng, Electrical Engineering, San Jose State University, USA

MEng, Electrical Engineering, San Jose State University, USA

MBA, Strategic Marketing, National University, USA

Ken (Xun) Liu

Chief Technology Officer
Power Systems Group

Ken is co-inventor of planar wireless inductive power transfer technology. He co-chairs the Wireless Power Consortium, Specifications Work Group. He co-architected Qi, the global wireless power standard. He led the development of patented wireless power technology to deliver 28 world first’s and proven productization. With 18 years’ experience in wireless power, power electromagnetics and power electronics, Ken published over 30 papers in IEEE journals and conferences. He won the IEEE 2009 Power Electronics Society Transaction Prize Award and is an IEEE senior member.

BEng, Honours, MSc, Electrical Engineering, Tsinghua University, PRC

PhD, Electrical Engineering, City University of Hong Kong, Hong Kong

Jack Pan

Chief Executive Officer

Jack is responsible for strategic initiatives across the chips plus systems business, including R&D, operations, sales and more. With over 10 years’ experience in wireless power, high speed and power systems, he founded a start-up in wireless charging ICs and system solutions, leading its 100%+ expansion in 3 years into SoC, analog and power management chipsets, modules and finished products. Jack previously worked for technology companies in Silicon Valley. An IEEE senior member, he has published more than 30 technical papers.

BEng, Electrical Engineering, Tsinghua University, PRC

PhD, Electrical Engineering, University of Missouri-Rolla, USA

Vikram Sangha

Chief Business Development Officer, US

Vik is responsible for business development and customer technical support of consumer electronics, automotive. He has over 18 years’ experience in the semiconductor, portable power and cellular handset businesses. Scaling growth and innovation platforms of over US$ 200mln revenues, Vik has led enterprise sales growth, product and global account management, business development across mobile, cloud and wireless businesses. He previously worked at Fairchild Semiconductor, Texas Instruments and National Semiconductor. A member of IEEE, Vik has published articles in EE Times, power and electronics publications.

BSc, Computer Engineering, Union College, USA

MBA, University of California, Berkeley, USA

Camille Tang

Senior Vice President

Camille is responsible for new revenue and international growth. She co-chairs, co-founded the Wireless Power Consortium. She co-founded and built a technology start-up from patented technology to proven productization globally with Tier 1 partnerships and 28 world first’s. With 40 years in senior management, she previously worked for Blanc de Chine, Continental Grain, Harvard Business School Research, HSBC Investment Bank, Macy’s California, Swiss Bank Corporation across consumer retail, corporate communications, derivatives trading, financial and risk control, intellectual property, leadership education, luxury design, M&A, partnerships.

BA, Distinction, Social Sciences, Stanford University, USA

MBA, Harvard University, USA

Emmanuel Girma

Chief Operation Officer, Power Systems Group

Emmanuel is responsible for sales operations in power systems. He has over 25 years senior management experience in wireless power technology and consumer electronics. He previously worked for Philips in emerging innovation, turnaround and mature businesses on global, regional and country levels, Then located in Netherlands and Hong Kong, he headed audio video, multi-branded businesses with over US$ 800 mln in sales including MP3’s, portable DVDs and home audio accessories, across general management, business category leadership, product strategy and marketing.

We Add Value Across IC Technology and System Design

30

150

330

Total System Adding Value: Chip + System

High Performance SoCs

Comprehensive SW and IP

Chip + System Design Experience

World Leading Power, Analog and Wireless Power Innovation

The Team

Michael Jin

Chairman, Chief Technology Officer

+

Jack Pan

Chief Executive Officer

+

Camille Tang

Senior Vice President

+

Majid Kafi

Vice President, General Manager, US Operation, Chip Business Group

+

Vikram Sangha

Chief Business Development Officer, US

+

Ken (Xun) Liu

Chief Technology Officer Power Systems Group

+

Emmanuel Girma

Chief Operation Officer Power Systems Group

+

Mohammad Nasser

Chief Scientist

BSc, Honours, Physics, Tehran University, Iran

PhD, Solid State Physics, University of California, Los Angeles, USA

Michael Jin

Chairman, Chief Technology Officer

BEng, Biomedical Engineering, Tsinghua University, PRC

MEng, Electrical Engineering, National University of Singapore, Singapore

PhD, Electrical Engineering, Stanford University, USA

Majid Kafi

Vice President, General Manager, US Operation, Chip Business Group

BEng, Electrical Engineering, San Jose State University, USA

MEng, Electrical Engineering, San Jose State University, USA

MBA, Strategic Marketing, National University, USA

Ken (Xun) Liu

Chief Technology Officer Power Systems Group

BEng, Honours, MSc, Electrical Engineering, Tsinghua University, PRC

PhD, Electrical Engineering, City University of Hong Kong, Hong Kong

Jack Pan

Chief Executive Officer

BEng, Electrical Engineering, Tsinghua University, PRC

PhD, Electrical Engineering, University of Missouri-Rolla, USA

Vikram Sangha

Chief Business Development Officer, US

BSc, Computer Engineering, Union College, USA

MBA, University of California, Berkeley, USA

Camille Tang

Senior Vice President

BA, Distinction, Social Sciences, Stanford University, USA

MBA, Harvard University, USA

Emmanuel Girma

Chief Operation Officer, Power Systems Group

BA, Economics, University of Paris Dauphine, France

MBA, University of Paris Dauphine, France

We Add Value Across IC Technology
and System Design

Comprehensive
SW and IP

Vice President, General Manager,
US Operation, Chip Business Group

Chief Technology Officer
Power Systems Group

Chief Operation Officer
Power Systems Group

Vice President, General Manager,
US Operation, Chip Business Group

Chief Technology Officer
Power Systems Group